Skip to product information
1 of 4

INTEL CPU 10TH GEN, I7-10700KF, LGA1200, 3.80GHz 16MB CACHE BOX, COMET LAKE, NO FAN [BX8070110700KF]

INTEL CPU 10TH GEN, I7-10700KF, LGA1200, 3.80GHz 16MB CACHE BOX, COMET LAKE, NO FAN [BX8070110700KF]

Visualizza tutti i prodotti INTEL

Vendor: Intel | Condition: Nuovo

Code: BX8070110700KF | EAN: 5032037188685

Regular price €365,43
Regular price €344,99 Sale price €365,43
Sale Sold out
Taxes included. Shipping calculated at checkout.
€299,53 IVA esclusa.

Spedizione a partire da €6,10

Low stock

Processing times

Usually dispatched within ➤ 1-2 working days

Delivery time

Delivery time (usually) ➤

1-2 working days

Product description

(NB: This sheet is to be considered purely informative and does not contain any type of guarantee, either implicit or explicit.)

Intel® Optane™ Memory Supported Intel® Optane™ memory is a revolutionary new category of non-volatile memory that resides between system memory and storage to accelerate system performance and response times. When combined with the Intel® Rapid Storage Technology driver, it directly manages multiple storage tiers by presenting a single virtual drive to the operating system and ensures that the most frequently used data is in the fastest storage tier. Intel® Optane™ memory requires specific hardware and software configuration. Intel® Turbo Boost Technology Intel® Turbo Boost Technology dynamically increases processor frequency when needed while taking advantage of additional temperature and power capacity to provide acceleration and reduce power consumption when needed. Intel® Hyper-Threading Technology Intel® Hyper-Threading Technology provides two processing threads for each physical core. Applications with a large number of threads can perform more operations in parallel, completing tasks in less time. Intel® Virtualization Technology Intel® Virtualization Technology (VT-x) allows a single hardware platform to act as multiple "virtual" platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing tasks into separate partitions. Intel® Virtualization Technology for Directed I/O Intel® Virtualization Technology for Directed I/O (VT-d) adds to existing virtualization support for IA-32 (VT-x) and Itanium® (VT-i) platforms support for virtualization of I/O devices. Intel VT-d enables users to improve system security and reliability and increase I/O device performance in virtualized environments. Intel® VT-x with Extended Page Tables Intel® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory-intensive virtualized applications. Extended Page Tables on Intel® Virtualization Technology platforms reduces power consumption, memory overhead, and increases battery life through hardware optimization of page table management. Intel® 64 The Intel® 64 architecture makes 64-bit computing available on server, workstation, desktop and mobile platforms when paired with supporting software¹. Intel 64 architecture offers a performance boost by allowing systems to use over 4GB of virtual and physical memory. Instruction set An instruction set is the basic set of commands and instructions that a microprocessor can recognize and execute. The indicated value represents the Intel instruction set with which the processor is compatible. Instruction Set Extensions Instruction set extensions are additional instructions that can improve performance when performing the same operations for multiple data objects. May include SSE (Streaming SIMD Extensions) and AVX (Advanced Vector Extensions). Idle States Idle states (C-states) are used to reduce power consumption when the processor is idle. C0 is the operational state and indicates that the CPU is performing useful operations. C1 is the first idle state, C2 the second, and so on. The more actions you take to reduce power consumption, the higher the number of C-states will be. Advanced Intel SpeedStep® Technology Advanced Intel SpeedStep® Technology is an advanced tool that enables high performance while meeting system power-saving requirements mobile. Traditional Intel SpeedStep® technology shifts voltage and frequency from higher to lower levels and back in response to processor workload. Advanced Intel SpeedStep® Technology builds on this architecture using design strategies such as separation between voltage and frequency changes, clock partitioning and recovery. Thermal Monitoring Technologies Temperature monitoring technologies protect the processor package and system from thermal failures through various temperature management functions. An on-die Digital Thermal Sensor (DTS) detects core temperature, and thermal management features reduce package power consumption and possibly temperature to stay within normal operating limits. Intel® Identity Protection Technology Intel® Identity Protection Technology is a security token that provides a simple method of tamper protection for secure access to online customer and business data. Intel® Identity Protection Technology is a hardware device that uniquely identifies a PC for access to websites, financial institutions, and network services by proving that the login attempt is not being made by malware. Intel® Identity Protection Technology can be a critical component of two-factor authentication solutions to protect information when accessing websites and using company data to log in.

Supported instructions SSE4.1, SSE4.2, AVX 2.0
Processor generation 10th Generation Intel® Core™ i7
Dedicated graphics card Not available
Box Yes
Intel® Transactional Synchronization Extensions No
Component for PC
Intel® Stable Image Platform Program (SIPP) No
Thermal Monitoring Technology Yes
Target market Gaming, Content Creation
Intel® VT-x with Extended Page Tables (EPT) Yes
Type of packaging Retail box
Intel® OS Guard Yes
Export Control Classification Number (ECCN) 5A992C
Intel® 64 Yes
Processor family Intel® Core™ i7
Intel® AES New Instructions (Intel® AES-NI) Yes
Processor code name Comet Lake
Launch date Q2'20
Intel® Virtualization Technology for Directed I/O (VT-d) Yes
Memory channels Dual-channel
Intel® Hyper Threading Technology (Intel® HT Technology) Yes
Processor lithograph 14 nm
Market segment Desktops
Bus speed 8 GT/s
Intel® Software Guard Extensions (Intel® SGX) Yes
Execute Disable Bit Yes
Intel® Boot Guard Yes
Intel Turbo Boost Max 3.0 technology Yes
Number of processor cores 8
Generation 10th Generation
Enhanced Intel SpeedStep technology Yes
Types of memory supported by the processor DDR4-SDRAM
Processor cache 16MB
System bus 8 GT/s
PCI Express CEM review 3.0
State Launched
Processor operating mode 64-bit
Automatic Commodity Classification Tracking System (CCATS) G077159
Maximum RAM supported 128GB
Intel® Turbo Boost Technology 2.0
Built-in options available No
Intel® vPro™ Platform Eligibility No
Intel® Trusted Execution Technology No
Intel Optane technology ready Yes
Data Integrity Check No
Increased Intel® Thermal Speed No
Memory bandwidth supported by processor (max) 45.8GB/s
Maximum number of Express PCI lanes 16
Processor manufacturer Intel
Harmonized System (HS) Code 85423119
Memory clock speeds supported by the processor 2933 MHz
Integrated graphics card model Not available
Processor base frequency 3.8GHz
Configurable TDP-down 95W
Idle States Yes
Supported memory types DDR4-SDRAM
Integrated graphics card No
Maximum internal memory supported by the processor 128GB
Tjunction 100°C
ARK ID processor 199325
Intel® Virtualization Technology (VT-x) Yes
Number of processor threads 16
Maximum turbo processor frequency 5.1GHz
Thermal Design Power (TDP) 125W
Intel® Identity Protection Technology (Intel® IPT) Yes
Intel® Turbo Boost Technology 2.0 frequency 5 GHz
Maximum memory 128GB
PCI Express configuration 1x16, 2x8, 1x8+2x4
Processor cache type Intelligent cache
Intel® Turbo Boost Max Technology 3.0 frequency 5.1GHz
Product type Processor
Separate graphics card adapter No
Processor socket LGA 1200 (Socket H5)
Intel® Secure Key Yes
Version of PCI Express slots 3.0
Description of the thermal solution PCG 2015D
Processor model i7-10700KF
Processor package size 37.5 x 37.5 mm
Configurable TDP-down frequency 3.5GHz
Scalability 1S
Cooler included No
CPU configuration (max) 1
View full details